Wiki source code of IC Subscopes
Version 1.1 by Uwe Trueggelmann on 2025/03/12 14:42
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| author | version | line-number | content |
|---|---|---|---|
| 1 | The following table defines the CQM Subscopes for the CQM Scope IC. | ||
| 2 | |||
| 3 | (% border="2" style="margin-right:auto" %) | ||
| 4 | |=((( | ||
| 5 | Short Name | ||
| 6 | )))|=Long Name|=Definition | ||
| 7 | |kIC|IC with a Contact Interface| | ||
| 8 | |pIC|IC with a Contactless Interface (Proximity IC)| | ||
| 9 | |bckIC|Grinding and polishing IC Wafer| | ||
| 10 | |rdlIC|Applying a Redistribution Layer to the IC Wafer| | ||
| 11 | |bmpIC|Applying Bumps to the IC Wafer| | ||
| 12 | |sawIC|Sawing the IC Wafer| | ||
| 13 | |||
| 14 | Some CQM Subscopes are applicable for all CQM Scopes. They are defined in the page Generic. |