IC Subscopes
Last modified by Uwe Trueggelmann on 2025/03/12 18:39
The following table defines the CQM Subscopes for the CQM Scope IC.
Short Name | Long Name | Definition |
|---|---|---|
| kIC | contact IC | IC with a Contact Interface |
| pIC | proximity IC | IC with a Contactless Interface (Proximity IC) |
| tstIC | test IC Wafer | Testing IC Wafers |
| bckIC | backside treatment of IC Wafer | Grinding and polishing IC Wafer |
| rdlIC | redistribution layer onto IC Wafer | Applying a Redistribution Layer to the IC Wafer |
| bmpIC | bumping the IC Wafer | Applying Bumps to the IC Wafer |
| sawIC | sawing the IC Wafer | Sawing the IC Wafer |
Some CQM Subscopes are applicable for all CQM Scopes. They are defined in the page Generic.