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7	7	Version 2.19 introduces the following main changes:
8	8
9	9	* Various clarifications in the QMS sections
10		-* **//#3100#: Cards made of materials other than newly produced PVC, and cards with an associated environmental claim – Requirement to maintain a valid CSI Letter//** amended with provisions regarding environmental claims.**//#3200#: CB, ICC, and IAC – Requirement to maintain a valid Mastercard Card Vendor Conformity Statement ("CVCS")//** introduced
	10	+* //#3100#: Cards made of materials other than newly produced PVC, and cards with an associated environmental claim – Requirement to maintain a valid CSI Letter// amended with provisions regarding environmental claims.//#3200#: CB, ICC, and IAC – Requirement to maintain a valid Mastercard Card Vendor Conformity Statement ("CVCS")// introduced
11	11	* For logo color measurement standard method is now CIEDE2000
12	12	* Major revision of #3036#: Hologram (including PBM), and the related test method, to align with Mastercard hologram supplier specification
13	13	* Revised provisions related to non-standard cards and CSI, e.g. #3100# Cards made of materials other than newly produced PVC – Requirement to maintain a valid CSI Letter, and equivalent for IAC added as #3110#
14		-* Fully described the antenna current alternative in **//#3064#: Reading Distance //**, and other improvements to the text
	14	+* Fully described the antenna current alternative in //#3064#: Reading Distance //, and other improvements to the text
15	15	* Simplifications for monitoring during Personalization
16	16	* Product structure revised, iacil and IAC now both separate products, and each have own worksheet in CQMAP.
17	17	* Revised requirements for Inlay for Interactive Cards (“iacil”) and Interactive Cards (“IAC”).
...	...	@@ -23,3 +23,46 @@
23	23	* Major rewrite of section 2.4 #B400# CQM Products and CQM Labels, and Modular Certification
24	24	* Major rewrite of section 3.2 #C200# Determining the applicable CQM Products
25	25	* Changes to the naming and structure of products, including their variants
	26	+
	27	+= 2.22 =
	28	+
	29	+Version 2.22 introduces the following main changes:
	30	+
	31	+* Adjustments to latest revisions of ISO/IEC 7810 and 10373-1.
	32	+* Full alignment of magnetic stripe requirements to ISO/IEC 7811-6, more stringent requirements in CQM removed.
	33	+* Expanding IAC requirements to accommodate fingerprint cards better.
	34	+* Clarifications and details to better handle subcontracting versus procuring from CQM certified suppliers, which has become more relevant with the more complex IAC supply chains.
	35	+
	36	+= 3a =
	37	+
	38	+Version 3a introduces the following main changes:
	39	+
	40	+* Substantially increased granularity of products and processes for audit and certification scope.
	41	+
	42	+=== Quality Management System Requirements ===
	43	+
	44	+* //#0654#: Design and Development – Product Qualification Report// — Lack of qualification data, and major NC without CSI letter now prohibit CQM certification
	45	+* IQC (Incoming Quality Control) to be assessed during CQM Audits for each CQM product and component, and not just once as part of the QMS
	46	+* //#0703# Release of Product and Services, Batch Yield Limit// — split into two independent requirements: //#0703#: Production and Service Provision – Release of Product and Services// and //#0707#: Production and Service Provision – Batch Yield Limit//; Batch Yield Limit now only applicable to products containing an IC.
	47	+* Requirements to implement SPC (//#0705#: Performance evaluation – Statistical Process Control//) and CpK (//#0811#: Performance evaluation – Process Capability//) restricted to ic icm iacicm bsm il iacil iac, that is, where processes involve wafer processing or IC packaging processes.
	48	+
	49	+=== Product Requirements ===
	50	+
	51	+* #3046#: Resistance to Chemicals — For CQM products and components where// #3058#: Solidity – Adhesion of ICM to Card// is required, clarified that one sample per solution shall be tested for //#3058#: Solidity – Adhesion of ICM to Card//
	52	+* //#3050#: ESD Conductivity – ESC — //Increased permitted levels of ESD conductivity
	53	+* //#3067#: Suitability for an Identification Notch — //Permitting greater tolerances
	54	+* //#3110#: IAC – Interactive Cards – Requirement to maintain a valid CSI Letter// — restricted to specific products, clarified to which products and components this requirement still applies.
	55	+* //#3120#: Pilot, innovative, and interactive cardholder identification products// – //requirement to undergo CQM Audits depending on annual production volume// — New requirement easing CQM audit and CQM certification requirements for innovative and interactive cardholder products with very small volumes.
	56	+* //#3130#: Products that are not compliant with applicable CQM requirements – Requirement to maintain a valid CSI Letter// — Now an individual requirement to clarify better that CQM non conformities must be covered by a CSI letter.
	57	+* //#3057#: 3 wheel Test Robustness for Interactive Cards (“IAC”) and ICC made without an ICM// — added clarification regarding re-using samples and regarding interpretation of test results with higher force than required.
	58	+* //#2041#: Fingerprint Sensor – Resistance to Abrasion// — Reworded to improve understanding.
	59	+* //#3058#: Solidity – Adhesion of ICM to Card// — Separate minimum value defined for rupture of the ICM, provided the ICM remains attached in all corners of the ICC.
	60	+* //#2805#: Antenna Design – Minimum distance between mechanical personalization areas and the antenna in IL, ICC, IAC// — Wording revised to better accommodate IAC.
	61	+
	62	+=== Test methods ===
	63	+
	64	+* //#7010#: Pantone-Colours//  — specified measurement parameters for colour measurement using spectrometer
	65	+* //#7120#: Security Devices (Hologram, PBM, magnetic stripe with hologram like surface, Signature Panel) – Adhesion, Aspect and Shape, Size and Positioning// — clarified that if cross-hatch necessary, a new sample shall be used
	66	+* //#8093#: Temperature Cycling// — extended maximum period between removal from oven and verification of functionality to 72 h to accommodate weekends
	67	+* #8230#: //Solidity – ICM Adhesion – Back of Card Spot Pressure Test// — Clarified positioning of centre of pressure for multicentric ICM, for example combining ISO/IEC 7816-2 contacts and a fingerprint sensor into a single ICM
	68	+* //#8310#: Resistance of a Fingerprint Sensor against Scratching// — Additional details specified