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44	44	* //#0654#: Design and Development – Product Qualification Report// — Lack of qualification data, and major NC without CSI letter now prohibit CQM certification
45	45	* IQC (Incoming Quality Control) to be assessed during CQM Audits for each CQM product and component, and not just once as part of the QMS
	46	+* //#0662#: Requirements for Products and Services – Determining the Requirements for Products and Services, Order Specification// — Order Specification appended to title to clarify that an Order Specification is required, verbiage added to clarify Order Specification
46	46	* //#0703# Release of Product and Services, Batch Yield Limit// — split into two independent requirements: //#0703#: Production and Service Provision – Release of Product and Services// and //#0707#: Production and Service Provision – Batch Yield Limit//; Batch Yield Limit now only applicable to products containing an IC.
47	47	* Requirements to implement SPC (//#0705#: Performance evaluation – Statistical Process Control//) and CpK (//#0811#: Performance evaluation – Process Capability//) restricted to ic icm iacicm bsm il iacil iac, that is, where processes involve wafer processing or IC packaging processes.
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49	49	=== Product Requirements ===
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51		-* #3046#: Resistance to Chemicals — For CQM products and components where// #3058#: Solidity – Adhesion of ICM to Card// is required, clarified that one sample per solution shall be tested for //#3058#: Solidity – Adhesion of ICM to Card//
	52	+* #3046#: Resistance to Chemicals — For CQM products and components where// #3058#: Solidity – Adhesion of ICM to Card// is required, clarified that one sample per solution shall be tested for //#3058#: Solidity – Adhesion of ICM to Card//
52	52	* //#3050#: ESD Conductivity – ESC — //Increased permitted levels of ESD conductivity
53	53	* //#3067#: Suitability for an Identification Notch — //Permitting greater tolerances
54	54	* //#3110#: IAC – Interactive Cards – Requirement to maintain a valid CSI Letter// — restricted to specific products, clarified to which products and components this requirement still applies.
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64	64	* //#7010#: Pantone-Colours//  — specified measurement parameters for colour measurement using spectrometer
65	65	* //#7120#: Security Devices (Hologram, PBM, magnetic stripe with hologram like surface, Signature Panel) – Adhesion, Aspect and Shape, Size and Positioning// — clarified that if cross-hatch necessary, a new sample shall be used
66	66	* //#8093#: Temperature Cycling// — extended maximum period between removal from oven and verification of functionality to 72 h to accommodate weekends
67		-* #8230#: //Solidity – ICM Adhesion – Back of Card Spot Pressure Test// — Clarifed positioning of centre of pressure for multicentric ICM, for example combining ISO/IEC 7816-2 contacts and a fingerprint sensor into a single ICM
	68	+* #8230#: //Solidity – ICM Adhesion – Back of Card Spot Pressure Test// — Clarified positioning of centre of pressure for multicentric ICM, for example combining ISO/IEC 7816-2 contacts and a fingerprint sensor into a single ICM
68	68	* //#8310#: Resistance of a Fingerprint Sensor against Scratching// — Additional details specified