Summary

• Page properties (1 modified, 0 added, 0 removed)

Details

Page properties

Content

...	...	@@ -43,12 +43,14 @@
43	43
44	44	* //#0654#: Design and Development – Product Qualification Report// — Lack of qualification data, and major NC without CSI letter now prohibit CQM certification
45	45	* IQC (Incoming Quality Control) to be assessed during CQM Audits for each CQM product and component, and not just once as part of the QMS
	46	+* //#0662#: Requirements for Products and Services – Determining the Requirements for Products and Services, Order Specification// — Order Specification appended to title to clarify that an Order Specification is required, verbiage added to clarify Order Specification
46	46	* //#0703# Release of Product and Services, Batch Yield Limit// — split into two independent requirements: //#0703#: Production and Service Provision – Release of Product and Services// and //#0707#: Production and Service Provision – Batch Yield Limit//; Batch Yield Limit now only applicable to products containing an IC.
47	47	* Requirements to implement SPC (//#0705#: Performance evaluation – Statistical Process Control//) and CpK (//#0811#: Performance evaluation – Process Capability//) restricted to ic icm iacicm bsm il iacil iac, that is, where processes involve wafer processing or IC packaging processes.
	49	+* A range of QMS requirements, primarily around the design process, moved from QMS worksheet in cqmAP to product specific worksheets, requiring the related processes to be in place for each CQM product, and to be verified during the CQM Audit for each CQM product.
48	48
49	49	=== Product Requirements ===
50	50
51		-* #3046#: Resistance to Chemicals — For CQM products and components where// #3058#: Solidity – Adhesion of ICM to Card// is required, clarified that one sample per solution shall be tested for //#3058#: Solidity – Adhesion of ICM to Card//
	53	+* #3046#: Resistance to Chemicals — For CQM products and components where// #3058#: Solidity – Adhesion of ICM to Card// is required, clarified that one sample per solution shall be tested for //#3058#: Solidity – Adhesion of ICM to Card//
52	52	* //#3050#: ESD Conductivity – ESC — //Increased permitted levels of ESD conductivity
53	53	* //#3067#: Suitability for an Identification Notch — //Permitting greater tolerances
54	54	* //#3110#: IAC – Interactive Cards – Requirement to maintain a valid CSI Letter// — restricted to specific products, clarified to which products and components this requirement still applies.
...	...	@@ -64,5 +64,5 @@
64	64	* //#7010#: Pantone-Colours//  — specified measurement parameters for colour measurement using spectrometer
65	65	* //#7120#: Security Devices (Hologram, PBM, magnetic stripe with hologram like surface, Signature Panel) – Adhesion, Aspect and Shape, Size and Positioning// — clarified that if cross-hatch necessary, a new sample shall be used
66	66	* //#8093#: Temperature Cycling// — extended maximum period between removal from oven and verification of functionality to 72 h to accommodate weekends
67		-* #8230#: //Solidity – ICM Adhesion – Back of Card Spot Pressure Test// — Clarifed positioning of centre of pressure for multicentric ICM, for example combining ISO/IEC 7816-2 contacts and a fingerprint sensor into a single ICM
	69	+* #8230#: //Solidity – ICM Adhesion – Back of Card Spot Pressure Test// — Clarified positioning of centre of pressure for multicentric ICM, for example combining ISO/IEC 7816-2 contacts and a fingerprint sensor into a single ICM
68	68	* //#8310#: Resistance of a Fingerprint Sensor against Scratching// — Additional details specified