Changes for page CQM Requirements - Change History
Last modified by Uwe Trueggelmann on 2025/02/15 00:20
Change comment:
There is no comment for this version
Summary
-
Page properties (1 modified, 0 added, 0 removed)
Details
- Page properties
-
- Content
-
... ... @@ -41,15 +41,15 @@ 41 41 42 42 === Quality Management System Requirements === 43 43 44 -* Lack of qualification data, and major NC without CSI letter prohibit CQM certification (#0654#)45 -* IQC (Incoming Quality Control) to be assessed for each product, and not just once as part of the QMS 46 -* Separation of#0703# Release of Product and Services, Batch Yield Limit,into two independent requirements #0703# and #0707#,Batch Yield Limit now only applicable to products containing an IC.47 -* Requirement to implement SPC and CpK restricted to ic icm iacicm bsm il iacil iac, s owhere processes involve wafer processing or IC packaging processes.44 +* //#0654#: Design and Development – Product Qualification Report// — Lack of qualification data, and major NC without CSI letter now prohibit CQM certification 45 +* IQC (Incoming Quality Control) to be assessed during CQM Audits for each CQM product and component, and not just once as part of the QMS 46 +* //#0703# Release of Product and Services, Batch Yield Limit// — split into two independent requirements: //#0703#: Production and Service Provision – Release of Product and Services// and //#0707#: Production and Service Provision – Batch Yield Limit//; Batch Yield Limit now only applicable to products containing an IC. 47 +* Requirements to implement SPC (//#0705#: Performance evaluation – Statistical Process Control//) and CpK (//#0811#: Performance evaluation – Process Capability//) restricted to ic icm iacicm bsm il iacil iac, that is, where processes involve wafer processing or IC packaging processes. 48 48 49 49 === Product Requirements === 50 50 51 51 * For cards, when testing Resistance to Chemicals, clarified that where// #3058#: Solidity – Adhesion of ICM to Card// is required, one sample per solution shall be tested for //#3058#: Solidity – Adhesion of ICM to Card// 52 -* Increased permitted levels of ESD conductivity for //#3050#: ESD Conductivity -ESC//52 +* Increased permitted levels of ESD conductivity for //#3050#: ESD Conductivity — ESC// 53 53 * Permitting greater tolerances in //#3067#: Suitability for an Identification Notch// 54 54 * //#3110#: IAC – Interactive Cards – Requirement to maintain a valid CSI Letter// restricted to specific products, clarified to which products and components this requirement still applies. 55 55 * Added //#3120#: Pilot, innovative, and interactive cardholder identification products requirement to undergo CQM Audits depending on annual production volume//, easing CQM audit and CQM certification requirements for innovative and interactive cardholder products with very small volumes.