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29	29	Version 2.22 introduces the following main changes:
30	30
31	31	* Adjustments to latest revisions of ISO/IEC 7810 and 10373-1.
32		-* Full alignment of magnetic stripe requirements to ISO/IEC 7811-6, more stringent requirements in CQM removed.
	32	+* Full alignment of magnetic stripe requirements to ISO/IEC 7811-6.
33	33	* Expanding IAC requirements to accommodate fingerprint cards better.
34	34	* Clarifications and details to better handle subcontracting versus procuring from CQM certified suppliers, which has become more relevant with the more complex IAC supply chains.
35		-
36		-= 3a =
37		-
38		-Version 3a introduces the following main changes:
39		-
40		-* Substantially increased granularity of products and processes for audit and certification scope.
41		-
42		-=== Quality Management System Requirements ===
43		-
44		-* //#0654#: Design and Development – Product Qualification Report// — Lack of qualification data, and major NC without CSI letter now prohibit CQM certification
45		-* IQC (Incoming Quality Control) to be assessed during CQM Audits for each CQM product and component, and not just once as part of the QMS
46		-* //#0703# Release of Product and Services, Batch Yield Limit// — split into two independent requirements: //#0703#: Production and Service Provision – Release of Product and Services// and //#0707#: Production and Service Provision – Batch Yield Limit//; Batch Yield Limit now only applicable to products containing an IC.
47		-* Requirements to implement SPC (//#0705#: Performance evaluation – Statistical Process Control//) and CpK (//#0811#: Performance evaluation – Process Capability//) restricted to ic icm iacicm bsm il iacil iac, that is, where processes involve wafer processing or IC packaging processes.
48		-
49		-=== Product Requirements ===
50		-
51		-* For cards, when testing Resistance to Chemicals, clarified that where// #3058#: Solidity – Adhesion of ICM to Card// is required, one sample per solution shall be tested for //#3058#: Solidity – Adhesion of ICM to Card//
52		-* Increased permitted levels of ESD conductivity for //#3050#: ESD Conductivity — ESC//
53		-* Permitting greater tolerances in //#3067#: Suitability for an Identification Notch//
54		-* //#3110#: IAC – Interactive Cards – Requirement to maintain a valid CSI Letter// restricted to specific products, clarified to which products and components this requirement still applies.
55		-* Added //#3120#: Pilot, innovative, and interactive cardholder identification products requirement to undergo CQM Audits depending on annual production volume//, easing CQM audit and CQM certification requirements for innovative and interactive cardholder products with very small volumes.
56		-* Made //#3130#: Products that are not compliant with applicable CQM requirements – Requirement to maintain a valid CSI Letter// individual requirement to clarify that CQM non conformities must be covered by a CSI letter.
57		-* //#3057#: 3 wheel Test Robustness for Interactive Cards (“IAC”) and ICC made without an ICM// — added clarification regarding re-using samples and regarding interpretation of test results with higher force than required.
58		-* //#2041#: Fingerprint Sensor – Resistance to Abrasion// — Reworded to improve understanding.
59		-* //#3058#: Solidity – Adhesion of ICM to Card// — TBD
60		-* //#2805#: Antenna Design – Minimum distance between mechanical personalization areas and the antenna in IL, ICC, IAC// — Wording revised to better accommodate IAC.
61		-
62		-=== Test methods ===
63		-
64		-* //#7010#: Pantone-Colours//  — specified measurement parameters for colour measurement using spectrometer
65		-* //#7120#: Security Devices (Hologram, PBM, magnetic stripe with hologram like surface, Signature Panel) – Adhesion, Aspect and Shape, Size and Positioning// — clarified that if cross-hatch necessary, a new sample shall be used
66		-* //#8310#: Resistance of a Fingerprint Sensor against Scratching// — Additional details specified