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From version < 2.8 >
edited by Uwe Trueggelmann
on 2024/11/21 14:54
To version < 2.3 >
edited by Uwe Trueggelmann
on 2024/11/21 14:23
>
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41 41  
42 42  === Quality Management System Requirements ===
43 43  
44 -* //#0654#: Design and Development – Product Qualification Report// — Lack of qualification data, and major NC without CSI letter now prohibit CQM certification
45 -* IQC (Incoming Quality Control) to be assessed during CQM Audits for each CQM product and component, and not just once as part of the QMS
46 -* //#0703# Release of Product and Services, Batch Yield Limit// — split into two independent requirements: //#0703#: Production and Service Provision – Release of Product and Services// and //#0707#: Production and Service Provision – Batch Yield Limit//; Batch Yield Limit now only applicable to products containing an IC.
47 -* Requirements to implement SPC (//#0705#: Performance evaluation – Statistical Process Control//) and CpK (//#0811#: Performance evaluation – Process Capability//) restricted to ic icm iacicm bsm il iacil iac, that is, where processes involve wafer processing or IC packaging processes.
44 +* Lack of qualification data, and major NC without CSI letter prohibit CQM certification (#0654#)
45 +* IQC (Incoming Quality Control) to be assessed for each product, and not just once as part of the QMS
46 +* Separation of #0703# Release of Product and Services, Batch Yield Limit, into two independent requirements #0703# and #0707#, Batch Yield Limit now only applicable to products containing an IC.
47 +* Requirement to implement SPC and CpK restricted to ic icm iacicm bsm il iacil iac, so where processes involve wafer processing or IC packaging processes.
48 48  
49 49  === Product Requirements ===
50 50  
51 51  * For cards, when testing Resistance to Chemicals, clarified that where// #3058#: Solidity – Adhesion of ICM to Card// is required, one sample per solution shall be tested for //#3058#: Solidity – Adhesion of ICM to Card//
52 -* Increased permitted levels of ESD conductivity for //#3050#: ESD Conductivity ESC//
52 +* Increased permitted levels of ESD conductivity for //#3050#: ESD Conductivity - ESC//
53 53  * Permitting greater tolerances in //#3067#: Suitability for an Identification Notch//
54 54  * //#3110#: IAC – Interactive Cards – Requirement to maintain a valid CSI Letter// restricted to specific products, clarified to which products and components this requirement still applies.
55 55  * Added //#3120#: Pilot, innovative, and interactive cardholder identification products requirement to undergo CQM Audits depending on annual production volume//, easing CQM audit and CQM certification requirements for innovative and interactive cardholder products with very small volumes.
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63 63  
64 64  * //#7010#: Pantone-Colours//  — specified measurement parameters for colour measurement using spectrometer
65 65  * //#7120#: Security Devices (Hologram, PBM, magnetic stripe with hologram like surface, Signature Panel) – Adhesion, Aspect and Shape, Size and Positioning// — clarified that if cross-hatch necessary, a new sample shall be used
66 -* //#8093#: Temperature Cycling// — extended maximum period between removal from oven and verification of functionality to 72h to accommodate weekends
67 67  * //#8310#: Resistance of a Fingerprint Sensor against Scratching// — Additional details specified
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