Changes for page CQM Requirements - Change History
Last modified by Uwe Trueggelmann on 2025/02/15 00:20
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... ... @@ -41,15 +41,15 @@ 41 41 42 42 === Quality Management System Requirements === 43 43 44 -* //#0654#: Design and Development – Product Qualification Report// —Lack of qualification data, and major NC without CSI letternowprohibit CQM certification45 -* IQC (Incoming Quality Control) to be assessed during CQM Auditsfor eachCQMproductand component, and not just once as part of the QMS46 -* //#0703# Release of Product and Services, Batch Yield Limit//— split into two independent requirements://#0703#:ProductionandService Provision – Release of Product and Services// and //#0707#:Production and Service Provision –Batch Yield Limit//;Batch Yield Limitnow only applicable to products containing an IC.47 -* Requirement sto implement SPC(//#0705#: Performance evaluation – Statistical Process Control//) and CpK(//#0811#: Performanceevaluation – Process Capability//)restricted to ic icm iacicm bsm il iacil iac,that is,where processes involve wafer processing or IC packaging processes.44 +* Lack of qualification data, and major NC without CSI letter prohibit CQM certification (#0654#) 45 +* IQC (Incoming Quality Control) to be assessed for each product, and not just once as part of the QMS 46 +* Separation of #0703# Release of Product and Services, Batch Yield Limit, into two independent requirements #0703# and #0707#, Batch Yield Limit now only applicable to products containing an IC. 47 +* Requirement to implement SPC and CpK restricted to ic icm iacicm bsm il iacil iac, so where processes involve wafer processing or IC packaging processes. 48 48 49 49 === Product Requirements === 50 50 51 51 * For cards, when testing Resistance to Chemicals, clarified that where// #3058#: Solidity – Adhesion of ICM to Card// is required, one sample per solution shall be tested for //#3058#: Solidity – Adhesion of ICM to Card// 52 -* Increased permitted levels of ESD conductivity for //#3050#: ESD Conductivity —ESC//52 +* Increased permitted levels of ESD conductivity for //#3050#: ESD Conductivity - ESC// 53 53 * Permitting greater tolerances in //#3067#: Suitability for an Identification Notch// 54 54 * //#3110#: IAC – Interactive Cards – Requirement to maintain a valid CSI Letter// restricted to specific products, clarified to which products and components this requirement still applies. 55 55 * Added //#3120#: Pilot, innovative, and interactive cardholder identification products requirement to undergo CQM Audits depending on annual production volume//, easing CQM audit and CQM certification requirements for innovative and interactive cardholder products with very small volumes. ... ... @@ -63,5 +63,4 @@ 63 63 64 64 * //#7010#: Pantone-Colours// — specified measurement parameters for colour measurement using spectrometer 65 65 * //#7120#: Security Devices (Hologram, PBM, magnetic stripe with hologram like surface, Signature Panel) – Adhesion, Aspect and Shape, Size and Positioning// — clarified that if cross-hatch necessary, a new sample shall be used 66 -* //#8093#: Temperature Cycling// — extended maximum period between removal from oven and verification of functionality to 72h to accommodate weekends 67 67 * //#8310#: Resistance of a Fingerprint Sensor against Scratching// — Additional details specified