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1 = Introduction =
2
3 Main changes in releases of the CQM Requirements:
4
5 = 2.19 =
6
7 Version 2.19 introduces the following main changes:
8
9 * Various clarifications in the QMS sections
10 * //#3100#: Cards made of materials other than newly produced PVC, and cards with an associated environmental claim – Requirement to maintain a valid CSI Letter// amended with provisions regarding environmental claims.//#3200#: CB, ICC, and IAC – Requirement to maintain a valid Mastercard Card Vendor Conformity Statement ("CVCS")// introduced
11 * For logo color measurement standard method is now CIEDE2000
12 * Major revision of #3036#: Hologram (including PBM), and the related test method, to align with Mastercard hologram supplier specification
13 * Revised provisions related to non-standard cards and CSI, e.g. #3100# Cards made of materials other than newly produced PVC – Requirement to maintain a valid CSI Letter, and equivalent for IAC added as #3110#
14 * Fully described the antenna current alternative in //#3064#: Reading Distance //, and other improvements to the text
15 * Simplifications for monitoring during Personalization
16 * Product structure revised, iacil and IAC now both separate products, and each have own worksheet in CQMAP.
17 * Revised requirements for Inlay for Interactive Cards (“iacil”) and Interactive Cards (“IAC”).
18
19 = 2.19.1 =
20
21 Version 2.19.1 introduces the following main changes:
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23 * Major rewrite of section 2.4 #B400# CQM Products and CQM Labels, and Modular Certification
24 * Major rewrite of section 3.2 #C200# Determining the applicable CQM Products
25 * Changes to the naming and structure of products, including their variants
26
27 = 2.22 =
28
29 Version 2.22 introduces the following main changes:
30
31 * Adjustments to latest revisions of ISO/IEC 7810 and 10373-1.
32 * Full alignment of magnetic stripe requirements to ISO/IEC 7811-6, more stringent requirements in CQM removed.
33 * Expanding IAC requirements to accommodate fingerprint cards better.
34 * Clarifications and details to better handle subcontracting versus procuring from CQM certified suppliers, which has become more relevant with the more complex IAC supply chains.
35
36 = 3a =
37
38 Version 3a introduces the following main changes:
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40 * Substantially increased granularity of products and processes for audit and certification scope.
41 * Lack of qualification data, and major NC without CSI letter prohibit CQM certification (#0654#)
42 * IQC (Incoming Quality Control) to be assessed for each product, and not just once as part of the QMS
43 * Separation of #0703# Release of Product and Services, Batch Yield Limit, into two independent requirements #0703# and #0707#, Batch Yield Limit now only applicable to products containing an IC.
44 * Requirement to implement SPC and CpK restricted to ic icm iacicm bsm il iacil iac, so processes involving wafer processing or IC packaging processes.
45 * For cards, when testing Resistance to Checmicals, clarified that where// #3058#: Solidity – Adhesion of ICM to Card// is required, one sample per solution shall be tested for //#3058#: Solidity – Adhesion of ICM to Card//
46 * Increased permitted levels of ESD conductivity for //#3050#: ESD Conductivity - ESC//
47 * Permitting greater tolerances in //#3067#: Suitability for an Identification Notch//
48 * //#3110#: IAC – Interactive Cards – Requirement to maintain a valid CSI Letter// restricted to specific products, clarified to which products and components this requirement still applies.
49 * Added //#3120#: Pilot, innovative, and interactive cardholder identification products requirement to undergo CQM Audits depending on annual production volume//, easing CQM audit and CQM certification requirements for innovative and interactive cardholder products with very small volumes.
50 * Made //#3130#: Products that are not compliant with applicable CQM requirements – Requirement to maintain a valid CSI Letter// individual requirement to clarify that CQM non conformities must be covered by a CSI letter.
51 *
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