Wiki source code of CQM Requirements - Change History
Version 4.1 by Uwe Trueggelmann on 2024/11/22 12:37
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| author | version | line-number | content |
|---|---|---|---|
| 1 | = Introduction = | ||
| 2 | |||
| 3 | Main changes in releases of the CQM Requirements: | ||
| 4 | |||
| 5 | = 2.19 = | ||
| 6 | |||
| 7 | Version 2.19 introduces the following main changes: | ||
| 8 | |||
| 9 | * Various clarifications in the QMS sections | ||
| 10 | * //#3100#: Cards made of materials other than newly produced PVC, and cards with an associated environmental claim – Requirement to maintain a valid CSI Letter// amended with provisions regarding environmental claims.//#3200#: CB, ICC, and IAC – Requirement to maintain a valid Mastercard Card Vendor Conformity Statement ("CVCS")// introduced | ||
| 11 | * For logo color measurement standard method is now CIEDE2000 | ||
| 12 | * Major revision of #3036#: Hologram (including PBM), and the related test method, to align with Mastercard hologram supplier specification | ||
| 13 | * Revised provisions related to non-standard cards and CSI, e.g. #3100# Cards made of materials other than newly produced PVC – Requirement to maintain a valid CSI Letter, and equivalent for IAC added as #3110# | ||
| 14 | * Fully described the antenna current alternative in //#3064#: Reading Distance //, and other improvements to the text | ||
| 15 | * Simplifications for monitoring during Personalization | ||
| 16 | * Product structure revised, iacil and IAC now both separate products, and each have own worksheet in CQMAP. | ||
| 17 | * Revised requirements for Inlay for Interactive Cards (“iacil”) and Interactive Cards (“IAC”). | ||
| 18 | |||
| 19 | = 2.19.1 = | ||
| 20 | |||
| 21 | Version 2.19.1 introduces the following main changes: | ||
| 22 | |||
| 23 | * Major rewrite of section 2.4 #B400# CQM Products and CQM Labels, and Modular Certification | ||
| 24 | * Major rewrite of section 3.2 #C200# Determining the applicable CQM Products | ||
| 25 | * Changes to the naming and structure of products, including their variants | ||
| 26 | |||
| 27 | = 2.22 = | ||
| 28 | |||
| 29 | Version 2.22 introduces the following main changes: | ||
| 30 | |||
| 31 | * Adjustments to latest revisions of ISO/IEC 7810 and 10373-1. | ||
| 32 | * Full alignment of magnetic stripe requirements to ISO/IEC 7811-6, more stringent requirements in CQM removed. | ||
| 33 | * Expanding IAC requirements to accommodate fingerprint cards better. | ||
| 34 | * Clarifications and details to better handle subcontracting versus procuring from CQM certified suppliers, which has become more relevant with the more complex IAC supply chains. | ||
| 35 | |||
| 36 | = 3a = | ||
| 37 | |||
| 38 | Version 3a introduces the following main changes: | ||
| 39 | |||
| 40 | * Substantially increased granularity of products and processes for audit and certification scope. | ||
| 41 | |||
| 42 | === Quality Management System Requirements === | ||
| 43 | |||
| 44 | * //#0654#: Design and Development – Product Qualification Report// — Lack of qualification data, and major NC without CSI letter now prohibit CQM certification | ||
| 45 | * IQC (Incoming Quality Control) to be assessed during CQM Audits for each CQM product and component, and not just once as part of the QMS | ||
| 46 | * //#0662#: Requirements for Products and Services – Determining the Requirements for Products and Services, Order Specification// — Order Specification appended to title to clarify that an Order Specification is required, verbiage added to clarify Order Specification | ||
| 47 | * //#0703# Release of Product and Services, Batch Yield Limit// — split into two independent requirements: //#0703#: Production and Service Provision – Release of Product and Services// and //#0707#: Production and Service Provision – Batch Yield Limit//; Batch Yield Limit now only applicable to products containing an IC. | ||
| 48 | * Requirements to implement SPC (//#0705#: Performance evaluation – Statistical Process Control//) and CpK (//#0811#: Performance evaluation – Process Capability//) restricted to ic icm iacicm bsm il iacil iac, that is, where processes involve wafer processing or IC packaging processes. | ||
| 49 | |||
| 50 | === Product Requirements === | ||
| 51 | |||
| 52 | * #3046#: Resistance to Chemicals — For CQM products and components where// #3058#: Solidity – Adhesion of ICM to Card// is required, clarified that one sample per solution shall be tested for //#3058#: Solidity – Adhesion of ICM to Card// | ||
| 53 | * //#3050#: ESD Conductivity – ESC — //Increased permitted levels of ESD conductivity | ||
| 54 | * //#3067#: Suitability for an Identification Notch — //Permitting greater tolerances | ||
| 55 | * //#3110#: IAC – Interactive Cards – Requirement to maintain a valid CSI Letter// — restricted to specific products, clarified to which products and components this requirement still applies. | ||
| 56 | * //#3120#: Pilot, innovative, and interactive cardholder identification products// – //requirement to undergo CQM Audits depending on annual production volume// — New requirement easing CQM audit and CQM certification requirements for innovative and interactive cardholder products with very small volumes. | ||
| 57 | * //#3130#: Products that are not compliant with applicable CQM requirements – Requirement to maintain a valid CSI Letter// — Now an individual requirement to clarify better that CQM non conformities must be covered by a CSI letter. | ||
| 58 | * //#3057#: 3 wheel Test Robustness for Interactive Cards (“IAC”) and ICC made without an ICM// — added clarification regarding re-using samples and regarding interpretation of test results with higher force than required. | ||
| 59 | * //#2041#: Fingerprint Sensor – Resistance to Abrasion// — Reworded to improve understanding. | ||
| 60 | * //#3058#: Solidity – Adhesion of ICM to Card// — Separate minimum value defined for rupture of the ICM, provided the ICM remains attached in all corners of the ICC. | ||
| 61 | * //#2805#: Antenna Design – Minimum distance between mechanical personalization areas and the antenna in IL, ICC, IAC// — Wording revised to better accommodate IAC. | ||
| 62 | |||
| 63 | === Test methods === | ||
| 64 | |||
| 65 | * //#7010#: Pantone-Colours// — specified measurement parameters for colour measurement using spectrometer | ||
| 66 | * //#7120#: Security Devices (Hologram, PBM, magnetic stripe with hologram like surface, Signature Panel) – Adhesion, Aspect and Shape, Size and Positioning// — clarified that if cross-hatch necessary, a new sample shall be used | ||
| 67 | * //#8093#: Temperature Cycling// — extended maximum period between removal from oven and verification of functionality to 72 h to accommodate weekends | ||
| 68 | * #8230#: //Solidity – ICM Adhesion – Back of Card Spot Pressure Test// — Clarified positioning of centre of pressure for multicentric ICM, for example combining ISO/IEC 7816-2 contacts and a fingerprint sensor into a single ICM | ||
| 69 | * //#8310#: Resistance of a Fingerprint Sensor against Scratching// — Additional details specified |