Wiki source code of CQM Requirements - Change History

Last modified by Uwe Trueggelmann on 2025/02/15 00:20

version	line-number	content
1.1	1	= Introduction =
	2
	3	Main changes in releases of the CQM Requirements:
	4
	5	= 2.19 =
	6
	7	Version 2.19 introduces the following main changes:
	8
	9	* Various clarifications in the QMS sections
1.2	10	* //#3100#: Cards made of materials other than newly produced PVC, and cards with an associated environmental claim – Requirement to maintain a valid CSI Letter// amended with provisions regarding environmental claims.//#3200#: CB, ICC, and IAC – Requirement to maintain a valid Mastercard Card Vendor Conformity Statement ("CVCS")// introduced
1.1	11	* For logo color measurement standard method is now CIEDE2000
	12	* Major revision of #3036#: Hologram (including PBM), and the related test method, to align with Mastercard hologram supplier specification
	13	* Revised provisions related to non-standard cards and CSI, e.g. #3100# Cards made of materials other than newly produced PVC – Requirement to maintain a valid CSI Letter, and equivalent for IAC added as #3110#
1.2	14	* Fully described the antenna current alternative in //#3064#: Reading Distance //, and other improvements to the text
1.1	15	* Simplifications for monitoring during Personalization
	16	* Product structure revised, iacil and IAC now both separate products, and each have own worksheet in CQMAP.
	17	* Revised requirements for Inlay for Interactive Cards (“iacil”) and Interactive Cards (“IAC”).
	18
	19	= 2.19.1 =
	20
	21	Version 2.19.1 introduces the following main changes:
	22
	23	* Major rewrite of section 2.4 #B400# CQM Products and CQM Labels, and Modular Certification
	24	* Major rewrite of section 3.2 #C200# Determining the applicable CQM Products
	25	* Changes to the naming and structure of products, including their variants
1.2	26
	27	= 2.22 =
	28
	29	Version 2.22 introduces the following main changes:
	30
	31	* Adjustments to latest revisions of ISO/IEC 7810 and 10373-1.
2.1	32	* Full alignment of magnetic stripe requirements to ISO/IEC 7811-6, more stringent requirements in CQM removed.
1.2	33	* Expanding IAC requirements to accommodate fingerprint cards better.
	34	* Clarifications and details to better handle subcontracting versus procuring from CQM certified suppliers, which has become more relevant with the more complex IAC supply chains.
2.2	35
	36	= 3a =
	37
	38	Version 3a introduces the following main changes:
	39
	40	* Substantially increased granularity of products and processes for audit and certification scope.
2.3	41
	42	=== Quality Management System Requirements ===
	43
2.4	44	* //#0654#: Design and Development – Product Qualification Report// — Lack of qualification data, and major NC without CSI letter now prohibit CQM certification
	45	* IQC (Incoming Quality Control) to be assessed during CQM Audits for each CQM product and component, and not just once as part of the QMS
3.2	46	* //#0662#: Requirements for Products and Services – Determining the Requirements for Products and Services, Order Specification// — Order Specification appended to title to clarify that an Order Specification is required, verbiage added to clarify Order Specification
2.4	47	* //#0703# Release of Product and Services, Batch Yield Limit// — split into two independent requirements: //#0703#: Production and Service Provision – Release of Product and Services// and //#0707#: Production and Service Provision – Batch Yield Limit//; Batch Yield Limit now only applicable to products containing an IC.
	48	* Requirements to implement SPC (//#0705#: Performance evaluation – Statistical Process Control//) and CpK (//#0811#: Performance evaluation – Process Capability//) restricted to ic icm iacicm bsm il iacil iac, that is, where processes involve wafer processing or IC packaging processes.
4.3	49	* A range of QMS requirements, primarily around the design process, moved from QMS worksheet in cqmAP to product specific worksheets, requiring the related processes to be in place for each CQM product, and to be verified during the CQM Audit for each CQM product.
2.3	50
	51	=== Product Requirements ===
	52
3.2	53	* #3046#: Resistance to Chemicals — For CQM products and components where// #3058#: Solidity – Adhesion of ICM to Card// is required, clarified that one sample per solution shall be tested for //#3058#: Solidity – Adhesion of ICM to Card//
2.9	54	* //#3050#: ESD Conductivity – ESC — //Increased permitted levels of ESD conductivity
	55	* //#3067#: Suitability for an Identification Notch — //Permitting greater tolerances
	56	* //#3110#: IAC – Interactive Cards – Requirement to maintain a valid CSI Letter// — restricted to specific products, clarified to which products and components this requirement still applies.
	57	* //#3120#: Pilot, innovative, and interactive cardholder identification products// – //requirement to undergo CQM Audits depending on annual production volume// — New requirement easing CQM audit and CQM certification requirements for innovative and interactive cardholder products with very small volumes.
	58	* //#3130#: Products that are not compliant with applicable CQM requirements – Requirement to maintain a valid CSI Letter// — Now an individual requirement to clarify better that CQM non conformities must be covered by a CSI letter.
2.3	59	* //#3057#: 3 wheel Test Robustness for Interactive Cards (“IAC”) and ICC made without an ICM// — added clarification regarding re-using samples and regarding interpretation of test results with higher force than required.
	60	* //#2041#: Fingerprint Sensor – Resistance to Abrasion// — Reworded to improve understanding.
2.13	61	* //#3058#: Solidity – Adhesion of ICM to Card// — Separate minimum value defined for rupture of the ICM, provided the ICM remains attached in all corners of the ICC.
2.3	62	* //#2805#: Antenna Design – Minimum distance between mechanical personalization areas and the antenna in IL, ICC, IAC// — Wording revised to better accommodate IAC.
	63
	64	=== Test methods ===
	65
	66	* //#7010#: Pantone-Colours// — specified measurement parameters for colour measurement using spectrometer
	67	* //#7120#: Security Devices (Hologram, PBM, magnetic stripe with hologram like surface, Signature Panel) – Adhesion, Aspect and Shape, Size and Positioning// — clarified that if cross-hatch necessary, a new sample shall be used
2.13	68	* //#8093#: Temperature Cycling// — extended maximum period between removal from oven and verification of functionality to 72 h to accommodate weekends
2.14	69	* #8230#: //Solidity – ICM Adhesion – Back of Card Spot Pressure Test// — Clarified positioning of centre of pressure for multicentric ICM, for example combining ISO/IEC 7816-2 contacts and a fingerprint sensor into a single ICM
2.3	70	* //#8310#: Resistance of a Fingerprint Sensor against Scratching// — Additional details specified