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Last modified by SuperUwe Trueggelmann on 2026/03/09 01:55
From version 4.1
edited by Uwe Trueggelmann
on 2024/11/22 20:37
Change comment: There is no comment for this version
To version 9.1
edited by SuperUwe Trueggelmann
on 2026/03/09 01:55
Change comment: There is no comment for this version

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38 38  Version 3a introduces the following main changes:
39 39  
40 40  * Substantially increased granularity of products and processes for audit and certification scope.
41 +* Introduction of the severity of Critical Non-Conformity ("NCC") into the CQM system. A NCC prevents certification until resolved.
41 41  
42 42  === Quality Management System Requirements ===
43 43  
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46 46  * //#0662#: Requirements for Products and Services – Determining the Requirements for Products and Services, Order Specification// — Order Specification appended to title to clarify that an Order Specification is required, verbiage added to clarify Order Specification
47 47  * //#0703# Release of Product and Services, Batch Yield Limit// — split into two independent requirements: //#0703#: Production and Service Provision – Release of Product and Services// and //#0707#: Production and Service Provision – Batch Yield Limit//; Batch Yield Limit now only applicable to products containing an IC.
48 48  * Requirements to implement SPC (//#0705#: Performance evaluation – Statistical Process Control//) and CpK (//#0811#: Performance evaluation – Process Capability//) restricted to ic icm iacicm bsm il iacil iac, that is, where processes involve wafer processing or IC packaging processes.
50 +* A range of QMS requirements, primarily around the design process, moved from QMS worksheet in cqmAP to product specific worksheets, requiring the related processes to be in place for each CQM product, and to be verified during the CQM Audit for each CQM product.
49 49  
50 50  === Product Requirements ===
51 51  
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67 67  * //#8093#: Temperature Cycling// — extended maximum period between removal from oven and verification of functionality to 72 h to accommodate weekends
68 68  * #8230#: //Solidity – ICM Adhesion – Back of Card Spot Pressure Test// — Clarified positioning of centre of pressure for multicentric ICM, for example combining ISO/IEC 7816-2 contacts and a fingerprint sensor into a single ICM
69 69  * //#8310#: Resistance of a Fingerprint Sensor against Scratching// — Additional details specified
72 +
73 += 3a =
74 +
75 +Version 3a introduces the following main changes:
76 +
77 +* #0762#: Amended with clarification what changes to the CQM Scope are required to be notified
78 +* #3140#: Defines the different types of CQM Assessment
79 +* cqmAP: Worksheet "Audit Scope & Compliance" has now added column defining which type of CQM Assessment is required to expand the scope of the CQM Certificate for each subscope