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Last modified by SuperUwe Trueggelmann on 2026/03/09 01:55
From version 6.1
edited by Uwe Trueggelmann
on 2025/05/05 18:21
Change comment: There is no comment for this version
To version 2.11
edited by Uwe Trueggelmann
on 2024/11/21 23:04
Change comment: There is no comment for this version

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... ... @@ -38,20 +38,17 @@
38 38  Version 3a introduces the following main changes:
39 39  
40 40  * Substantially increased granularity of products and processes for audit and certification scope.
41 -* Introduction of the severety of Critical Non-Conformity ("NCC") into the CQM system. A NCC prevents certification until resolved.
42 42  
43 43  === Quality Management System Requirements ===
44 44  
45 45  * //#0654#: Design and Development – Product Qualification Report// — Lack of qualification data, and major NC without CSI letter now prohibit CQM certification
46 46  * IQC (Incoming Quality Control) to be assessed during CQM Audits for each CQM product and component, and not just once as part of the QMS
47 -* //#0662#: Requirements for Products and Services – Determining the Requirements for Products and Services, Order Specification// — Order Specification appended to title to clarify that an Order Specification is required, verbiage added to clarify Order Specification
48 48  * //#0703# Release of Product and Services, Batch Yield Limit// — split into two independent requirements: //#0703#: Production and Service Provision – Release of Product and Services// and //#0707#: Production and Service Provision – Batch Yield Limit//; Batch Yield Limit now only applicable to products containing an IC.
49 49  * Requirements to implement SPC (//#0705#: Performance evaluation – Statistical Process Control//) and CpK (//#0811#: Performance evaluation – Process Capability//) restricted to ic icm iacicm bsm il iacil iac, that is, where processes involve wafer processing or IC packaging processes.
50 -* A range of QMS requirements, primarily around the design process, moved from QMS worksheet in cqmAP to product specific worksheets, requiring the related processes to be in place for each CQM product, and to be verified during the CQM Audit for each CQM product.
51 51  
52 52  === Product Requirements ===
53 53  
54 -* #3046#: Resistance to Chemicals — For CQM products and components where// #3058#: Solidity – Adhesion of ICM to Card// is required, clarified that one sample per solution shall be tested for //#3058#: Solidity – Adhesion of ICM to Card//
51 +* #3046#: Resistance to Chemicals — For CQM products and components where// #3058#: Solidity – Adhesion of ICM to Card// is required, clarified that one sample per solution shall be tested for //#3058#: Solidity – Adhesion of ICM to Card//
55 55  * //#3050#: ESD Conductivity – ESC — //Increased permitted levels of ESD conductivity
56 56  * //#3067#: Suitability for an Identification Notch — //Permitting greater tolerances
57 57  * //#3110#: IAC – Interactive Cards – Requirement to maintain a valid CSI Letter// — restricted to specific products, clarified to which products and components this requirement still applies.
... ... @@ -59,7 +59,7 @@
59 59  * //#3130#: Products that are not compliant with applicable CQM requirements – Requirement to maintain a valid CSI Letter// — Now an individual requirement to clarify better that CQM non conformities must be covered by a CSI letter.
60 60  * //#3057#: 3 wheel Test Robustness for Interactive Cards (“IAC”) and ICC made without an ICM// — added clarification regarding re-using samples and regarding interpretation of test results with higher force than required.
61 61  * //#2041#: Fingerprint Sensor – Resistance to Abrasion// — Reworded to improve understanding.
62 -* //#3058#: Solidity – Adhesion of ICM to Card// — Separate minimum value defined for rupture of the ICM, provided the ICM remains attached in all corners of the ICC.
59 +* //#3058#: Solidity – Adhesion of ICM to Card// — TBD
63 63  * //#2805#: Antenna Design – Minimum distance between mechanical personalization areas and the antenna in IL, ICC, IAC// — Wording revised to better accommodate IAC.
64 64  
65 65  === Test methods ===
... ... @@ -66,6 +66,5 @@
66 66  
67 67  * //#7010#: Pantone-Colours//  — specified measurement parameters for colour measurement using spectrometer
68 68  * //#7120#: Security Devices (Hologram, PBM, magnetic stripe with hologram like surface, Signature Panel) – Adhesion, Aspect and Shape, Size and Positioning// — clarified that if cross-hatch necessary, a new sample shall be used
69 -* //#8093#: Temperature Cycling// — extended maximum period between removal from oven and verification of functionality to 72 h to accommodate weekends
70 -* #8230#: //Solidity – ICM Adhesion – Back of Card Spot Pressure Test// — Clarified positioning of centre of pressure for multicentric ICM, for example combining ISO/IEC 7816-2 contacts and a fingerprint sensor into a single ICM
66 +* //#8093#: Temperature Cycling// — extended maximum period between removal from oven and verification of functionality to 72h to accommodate weekends
71 71  * //#8310#: Resistance of a Fingerprint Sensor against Scratching// — Additional details specified