The following table defines the CQM Subscopes for the CQM Scope IC.

Short Name

Long NameDefinition
kICIC with a Contact Interface 
pICIC with a Contactless Interface (Proximity IC) 
bckICGrinding and polishing IC Wafer 
rdlICApplying a Redistribution Layer to the IC Wafer 
bmpICApplying Bumps to the IC Wafer 
sawICSawing the IC Wafer 

Some CQM Subscopes are applicable for all CQM Scopes. They are defined in the page Generic.

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Created by Uwe Trueggelmann on 2025/03/12 14:50
  
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