Wiki source code of IC Subscopes

Last modified by Uwe Trueggelmann on 2025/03/12 18:39

author	version	line-number	content
		1	The following table defines the CQM Subscopes for the CQM Scope IC.
		2
		3	(% border="2" style="margin-right:auto" %)
		4	\|=(((
		5	Short Name
		6	)))\|=Long Name\|=Definition
		7	\|kIC\|contact IC\|IC with a Contact Interface
		8	\|pIC\|proximity IC\|IC with a Contactless Interface (Proximity IC)
		9	\|tstIC\|test IC Wafer\|Testing IC Wafers
		10	\|bckIC\|backside treatment of IC Wafer\|Grinding and polishing IC Wafer
		11	\|rdlIC\|redistribution layer onto IC Wafer\|Applying a Redistribution Layer to the IC Wafer
		12	\|bmpIC\|bumping the IC Wafer\|Applying Bumps to the IC Wafer
		13	\|sawIC\|sawing the IC Wafer\|Sawing the IC Wafer
		14
		15	Some CQM Subscopes are applicable for all CQM Scopes. They are defined in the page [[Generic>>doc:CQM Requirements.CQM Products and Components.Generic Subscopes.WebHome]].

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